Viscosity variation protective film

(Heating Curing Type Protective film) Heating Curing Type Protective film

 The initial adhesion is very high for all kinds of adhesives, and after heating, the adhesive layer cures and the adhesion is greatly reduced, making delamination very convenient.

The degree of viscosity reduction can be adjusted by selecting the curing temperature according to the process.

 If you choose the substrate-free type, it can be used as double-sided tape to increase the production twice.

• Metal Etching Protection.

• Wafer Level Packaging, LED, and glass parts cutting process.

(UV Tape\UV Curing Protective Film)

 Excellent initial adhesion to all types of adhesives. UV irradiation significantly reduces adhesion and facilitates removal.

 Suitable for substrate parts fixing or supporting in the working industry.

• Ceramic capacitors, PCB fixed support film.

• Wafer Level Packaging, LED, and glass parts cutting process.

• Metal etching protection.

 Cooling Stripping Type Protective film

 Normal temperature adhesion, when the process temperature is high, the adhesion will also increase, so there is no need to worry about the risk of delamination during the process. After the process is cooled down, the adhesiveness will be reduced, so it is easy to tear off and no adhesive residue will be left.

• FPC Horizontal Electrolytic Plating, Thermocompression Protection.

• Ceramic capacitor, PCB fixed support film.

• High temperature processing of film materials.

(Heat-resistant protective film)

Normal temperature adhesion, when the process temperature is high, the adhesion will also increase, so there is no need to worry about the risk of delamination during the process. After the process is cooled down, the adhesiveness will be reduced, so it is easy to tear off and no adhesive residue will be left.

 It can withstand high temperature up to 250’C.

• Reflow soldering process.

• Related high temperature process.